Enhancing Human Capabilities, Driving Innovation

About Us

We continually strive to understand the challenges our customers face in vacuum environment gripping and clean environment requirements. We take pride in our leading position as a solution provider for vacuum environment gripping and clean environment, supporting our customers' productivity goals.

Providing More System Services for Microelectronics Device Manufacturers, Including Semiconductor

We continue to innovate leading technical solutions that will enhance your process start-up time, yield, throughput, and safety compliance, while striving to balance the often conflicting requirements of reducing environmental emissions and extending product lifecycles, reducing ongoing service costs, and lowering total ownership costs.

We serve leading semiconductor manufacturing factories and strive to be a first-class semiconductor process equipment service provider. Our products and technologies are designed to meet the specific requirements of existing and evolving processes. We offer a variety of high-end applications and rigorous process products and services, such as electrostatic suction cups, cleanroom systems, and vacuum equipment systems, to optimize the performance of various applications from light to heavy loads.

In the mid-stage manufacturing sector of semiconductors, our electrostatic suction cups are used for demanding processes such as PVD physical vapor deposition, CVD chemical vapor deposition, and ETCH dry etching of wafer vacuum clamping; in the later stages of advanced packaging, thinning processes, electrostatic suction cups provide a strong and stable wafer clamping method, improving wafer thinning yield and the efficiency of EFEM/Sorter.

We are a leading manufacturer and refurbisher of Mca/Aln electrostatic suction cups in China. We closely follow and actively participate in the development and innovation of semiconductor technology, and have been researching the renewable technology and repair refurbishment of electrostatic suction cups (LAM, TEL, AMAT) for demanding processes such as PVD physical vapor deposition, CVD chemical vapor deposition, and ETCH dry etching. In this field, I have accumulated rich technical experience.

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