Complex Type Electrostatic Chuck / Heater

The complex type electrostatic chuck and heater are compatible with clamping various types of wafers, including silicon, gallium arsenide, silicon carbide, and sapphire. This compatibility helps reduce line change costs for equipment manufacturers and end users. Utilizing sintered ceramic technology and polymer modification technology, combined with integrated vacuum lamination and thermal bonding, these chucks reduce internal thermal resistance, achieve internal temperature uniformity, and form a dense dielectric insulation layer, enhancing ion migration resistance.

Complex Type Electrostatic Chuck

• Advanced TechnologiesUtilizes sintered ceramic and polymer modification technologies for higher density structure and lower outgassing.
• Strict Layer ControlFeatures precise control over the thickness of the dielectric layer and electrode group.
• Versatile Clamping CapabilityCompatible with wafers made of various materials.
• Precise Resistivity ControlAllows for stronger electrostatic clamping force.
• Cost-Effective and Short Lead TimesSuitable for process development and new equipment validation.

Complex Type Electrostatic Chuck With Heater

• Multi-Zone Heating LayoutCapable of implementing multiple heating zones with excellent temperature uniformity (±3.5%℃ @150℃).
• High-Density Lamination TechnologyAchieved through vacuum lamination, with a maximum heating temperature of 200℃.
• Uniform Heating CurvesOffers a wide range of heating curve settings.
• Cost-Effective and Short Lead TimesSuitable for process development and new equipment validation.